DD3合金TLP扩散焊等温凝固过程研究  

Isothermal Solidification Process of TLP Diffusion Bonding for DD3 Superalloy

作　　者：李晓红[1] 叶雷[1] 钟群鹏[2] 曹春晓[1] 熊华平[1] 

机构地区：[1]北京航空材料研究院,北京100095 [2]北京航空航天大学,北京1000191

出　　处：《航空材料学报》2011年第6期1-6,共6页Journal of Aeronautical Materials

摘　　要：采用一种含B中间层合金在不同温度下保温不同时间TLP连接DD3高温合金。观察不同连接规范下的焊缝组织并测定了焊缝中央共晶区域的宽度。研究发现,焊缝中央共晶宽度与保温时间的1/2次方成反比。由此推算出1150℃,1200℃和1250℃连接温度下等温凝固完成所需时间分别不超过3h,2h和1h。通过建立扩散模型并利用菲克第二定律的误差函数解,分别根据Ni-B和DD3-B模拟相图,计算了不同连接温度下焊缝完成等温凝固所需要的时间。计算结果表明对于给定的连接系统,存在一个连接温度的最佳值,在该温度下,焊缝等温凝固完成所需的时间最短。结果表明,对于DD3合金的TLP扩散焊,采用1250℃的连接温度比较合适。The TLP bonding process for DD3 superalloy using a B-contain interlayer alloy with different temperature and holding-time is analyzed.Microstructures of different joints were observed and the widths of the eutectic zone of the centre of the joints were measured.It shows that the width is inversely proportional to the square root of holding time.Based on the result,the time for isothermal-solidification at 1150℃,1200℃ and 1250℃ are not more than 3h,2h and 1h respectively by the estimation.By establishing the diffusion model and using the error function solution to the second Fick′s law,the time for isothermal-solidification at different temperature is calculated by Ni-B phase-diagram and DD3-B analogous phase-diagram,respectively.The calculated results show that for a certain bonding system,there exists an optimum temperature at which the time for isothermal solidification is the shortest.According to the experimental results,it is suitabk to choose 1250℃ as the bonding tamperatune for DD3 superalloy.

关 键 词：瞬间液相扩散焊 等温凝固 模型 

分 类 号：V223[航空宇航科学与技术—飞行器设计] V215.5