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作 者:王超逸[1] 吕丹[1] 苏洪英[1] 于秀蛾[1] 杨成波[1] 孙绍广[1]
机构地区:[1]鞍钢技术中心,鞍山114009
出 处:《理化检验(物理分册)》2011年第11期690-693,共4页Physical Testing and Chemical Analysis(Part A:Physical Testing)
摘 要:先用X射线衍射法再用盲孔法测定了同一试样的残余应力,对测试结果进行了分析比较。结果表明:对于残余应力分布不随深度改变的情况,两者结果一致;但对于其他情况,两种方法得到的结果不一致。通过测试残余应力沿试样深度的分布和从原理上比较两种测试方法的不同,得出盲孔法的测试结果受深层残余应力分布影响,而X射线衍射法的测试结果不受其影响。The residual stress of specimen has determined by two different methods including the Xray diffraction method and the blind-hole method. Compared with the results of two methods, it was found that, they were same in the condition that residual stress didn't change with depth; but in other condition, the results of X-ray diffraction method were a little higher than the results of blind hole method. By measuring the residual stresses in depth and studying on the principles of two methods, the conclusion was reached that the results of blind hole method were influenced by the residual stress in depth but the results of X-ray diffraction method were not.
分 类 号:TG115.222.2[金属学及工艺—物理冶金]
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