关键因素对化学镀铁镀速的影响研究  

Experimental Investigation on the Effect of Key Factors on Plating Rate of Electroless Iron Plating

作　　者：张敏[1] 李林泽[1] 何为[1] 胡文成[1] 万小波[2] 张云望[2] 杜凯[2] 张林[2] 

机构地区：[1]电子科技大学微电子与固体电子学院,成都610054 [2]中国工程物理研究院激光聚变中心,绵阳621900

出　　处：《材料导报》2011年第22期88-91,共4页Materials Reports

基　　金：国家自然科学基金委员会与中国工程物理研究院联合基金(10976006);四川省科技支撑项目(2009GZ0229)

摘　　要：以有机玻璃为镀件,通过化学镀铁工艺构建了应用于惯性约束核聚变实验的铁黑腔。采用离子钯为活性剂,考察了氯化钯质量浓度对镀层覆盖率的影响;详细研究了镀液中主盐硫酸亚铁、还原剂硼氢化钠和缓冲剂硼酸、工艺条件(pH值和温度)对镀速的影响规律。实验结果表明,随着镀液中主盐和还原剂质量浓度的增加,镀速明显加快;而缓冲剂对镀速的影响相对较小;随着pH值和温度的升高,镀速也明显加快。对相应的影响机制进行了探讨,为最终建立动力学方程打下了基础。Iron hohlraum target for application in inertial confinement fusion （[CF） experiment was prepared through an electroless iron plating process using poly（methyl methacrylate） （PMMA） as a substrate. The effect of the concentration of palladium ions on coverage ratio was investigated in activation step. The influence of components and plating parameters on plating rate was also discussed in detail. The results reveal that the plating rate increases obvi ously with the increase of the concentrations of ferrous sulfate, sodium borohydride and boric acid, pH value, and temperature. The relative mechanism was suggested, which is beneficial to the establishment of kinetic equation.

关 键 词：化学镀铁 离子钯 影响因素 镀速 

分 类 号：TQ153[化学工程—电化学工业]