应用软磨料磨削的单晶硅超精密制造技术  

Ultra-precision Manufacturing Technology with Soft Abrasive Grinding for Silicon

作　　者：金钊[1] 李锦胜[1] 康仁科[2] 张继友[1] 王永刚[1] 孟晓辉[1] 

机构地区：[1]北京空间机电研究所,北京100076 [2]大连理工大学精密与非传统加工教育部重点实验室,辽宁大连116024

出　　处：《光电工程》2011年第12期75-80,84,共7页Opto-Electronic Engineering

基　　金：国家自然科学基金-广东省联合基金(U0734008);国家自然科学基金(50675029)资助项目

摘　　要：在分析软磨料砂轮化学机械磨削(CMG)技术的基础上,开发研制了主料分别为Fe2O3和MgO的杯型软磨料砂轮。利用开发的两种软磨料砂轮对Ф150mm的单晶硅光学表面进行纳米级精度的对比磨削加工,优选出最佳磨削参数,将CMG的结果与金刚石砂轮磨削结果、化学机械抛光(CMP)结果进行对比研究,并对加工后工件的表面与亚表面损伤进行检测分析。结果表明,MgO软磨料砂轮具有十分稳定的磨削性能,能够获得较好的形状精度和表面亚表面质量,采用三维表面轮廓仪和原子力显微镜测量CMG后的工件表面分别得到0.568nmRMS和0.554nmRq的表面粗糙度,达到了CMP的加工效果,角度抛光法显示CMG后的工件亚表面损伤深度接近0。Based on analysis of Chemo-mechanical-grinding（CMG） technology with Soft Abrasive Grinding Wheel（SAGW）,cup-type SAGWs with Fe2O3 and MgO as the main material were respectively developed.The contrast grinding process with the developed two kinds of SAGWs was applied to nano-precision finishing for optical surface of silicon（Ф150 mm） and machining parameters were optimal selected.Contrastive analysis of CMG,diamond wheel grinding and Chemical Mechanical Polishing（CMP） for mirror were carried out.The surface and sub-surface damaged by CMG with SAGW were detected and analyzed.The results indicated that the grinding performance of MgO SAGW were stable.Good form precision and surface roughness were obtained.Measurement of CMG mirror from 3D surface profiler（0.568 nm RMS） or atomic force microscope（0.554 nm Rq） was reached to the roughness of CMP mirror.Sub-surface Damage Depth（SDD） by angle polishing method was detected,which was close to zero.

关 键 词：硅 软磨料 化学机械磨削 表面粗糙度 亚表面损伤 

分 类 号：TH74[机械工程—光学工程] TH70[机械工程—仪器科学与技术]