大功率LED筒灯散热分析  

Thermal Analysis of High-power LED Downlight

作　　者：马湘君[1] 吴礼刚[1] 戴世勋[1] 李继亮[2] 周伯友 白坤[1] 郑兆勇 

机构地区：[1]宁波大学信息科学与工程学院,浙江宁波315211 [2]宁波大学机械工程与力学学院,浙江宁波315211 [3]赛尔富电子有限公司,浙江宁波315103

出　　处：《照明工程学报》2011年第6期18-21,共4页China Illuminating Engineering Journal

基　　金：宁波市重大科技攻关项目(2010B10005);宁波市科技创新团队项目(2009B21007);宁波大学王宽诚幸福基金资助;宁波市自然科学基金项目(2010A610180)

摘　　要：随着LED芯片输出功率的不断提高,对大功率LED灯具的散热分析与设计已成为LED灯具封装的关键技术之一。本文利用有限元方法对LED灯具的温度场分布进行了模拟计算。计算结果表明15W LED筒灯温度场分布与实验结果吻合,在此基础上进一步分析了PCB导热率、导热胶导热率和芯片位置等因素对LED灯具散热效果的影响,分析结论为后期LED灯具散热优化设计提供了重要的参考依据。Thermal analysis and design of high power LED lamps have become a key technology to LED package due to the improvement of the LED output power.A detailed simulation of temperature distribution of LED lamp was made by ANSYS software.Based on the consistency of the 15W LED Downlight experimental and simulation results,the analysis and comparison of different thermal conductivities of MCPCB and thermal grease,the locations of chips of LED lamp were taken,which provides an effective reference for the optimal design.

关 键 词：大功率LED筒灯 散热分析 有限元方法 

分 类 号：TN312.8[电子电信—物理电子学]