新型热塑性聚酰亚胺改性环氧胶粘剂的研制  

Preparation of epoxy adhesive modified with new thermoplastic polyimide

作　　者：李恩[1] 虞鑫海[1] 徐永芬[1] 刘万章 

机构地区：[1]东华大学应用化学系,上海201620 [2]浙江金鹏化工股份有限公司,浙江台州318050

出　　处：《粘接》2011年第12期56-58,共3页Adhesion

摘　　要：采用含羧基聚酰亚胺粉末,对环氧树脂胶粘剂进行改性,制得新型环氧胶粘剂,其拉伸剪切强度可达30.0MPa以上,初始分解温度大于368.5℃。随着聚酰亚胺量的增加,其耐热性也相应提高。此外,环氧胶粘剂体系的疏水性也有一定程度的提高。Modifing epoxy resin adhesive system with carboxyl-containing polyimide powder,a new thermoplastic epoxy adhesive was obtained. Its tensile shear strength can be up to 30.0 MPa, and the initial thermal decomposition temperature is over 368.5℃ With increasing polyimide amount, the heat resistance was also increased.In addition,the hydrophobic properties of epoxy adhesive system had improvement.

关 键 词：聚酰亚胺(PI) 环氧树脂胶粘剂 改性 性能 

分 类 号：TQ433.437[化学工程]