FC-CBGA封装中高速差分信号过孔的设计与优化  

Design and Optimization of High Speed Differential Signal Via in Flip-Chip Ceramic BGA Packages

作　　者：胡晋[1] 金利峰[1] 郑浩[1] 

机构地区：[1]江南计算技术研究所,江苏无锡214083

出　　处：《微电子学》2011年第6期906-909,922,共5页Microelectronics

摘　　要：对FC-CBGA封装中高速差分信号过孔的设计与优化问题进行研究,分析了采用堆叠孔、增加地回流孔和增大过孔反焊盘尺寸这三种优化方法对减小电容和电感不连续性,以提高过孔电性能的具体影响。时频域仿真验证了所述优化方法能够有效降低高速差分信号插入损耗及回波损耗,提高信号过孔阻抗,改善高速差分信号传输性能。Design and optimization of high speed differential signal via in flip-chip ceramic BGA packages were studied.Effect of three optimization methods,including stacked via connection,adding ground return via and increasing antipad dimension,on minimization of capacitive or inductive discontinuities,so as to enhance via electrical performance,was analyzed.Simulation results showed that the optimized method can reduce insertion loss and return loss of high speed differential signals,and increase impedance of signal via,thus improving transmission performance of high speed differential signal.

关 键 词：倒装陶瓷球栅阵列封装 差分过孔 S参数 时域反射计 

分 类 号：TN401[电子电信—微电子学与固体电子学]