微晶钛合金薄板粉末包埋渗铝及铝硅共渗研究  

Pack Aluminized and Silicon Aluminized on Microcrystal Ti-Alloy Sheets

作　　者：卢亮[1] 李明伟[2] 赫晓东[1] 

机构地区：[1]哈尔滨工业大学复合材料研究所,哈尔滨150001 [2]哈尔滨工业大学金属精密热加工国家级重点实验室,哈尔滨150001

出　　处：《宇航材料工艺》2011年第6期63-65,69,共4页Aerospace Materials & Technology

摘　　要：采用粉末包埋法对电子束物理气相(EB-PVD)制备钛合金薄板在620℃分别进行6h渗铝及铝硅共渗,采用XRD、SEM等对EB-PVD制备钛合金薄板显微组织以及粉末包埋法渗铝及Al-Si共渗后的钛合金薄板显微组织结构进行研究。结果表明,微晶合金可以在620℃实现渗铝和铝硅共渗。渗铝层的相结构主要为Al3Ti相,但由于渗层Al3Ti相为脆性相,在渗后冷却过程中热应力的作用下,易产生裂纹。铝硅共渗层的相结构主要为Al3Ti和Ti5Si3相,由于Si存在渗层中,渗层中不存在裂纹。The pack aluminized and silicon aluminized at 620℃ for 6 hours on Ti-alloy sheet fabricated by electron beam physical vapor deposition （EB-PVD） technique was investigated. Surfaces and cross-sec- tions of the aluminized specimens were studied by scanning electron microscopy （SEM）. Phase identification of the oxide scale was performed by X-ray diffraction （GAXRD） and energy dispersive analysis of X-rays （EDAX）. The results show that aluminizing could be carried out at 620℃. The phase construction of the a- luminized coating is AI3 Ti. However, as Al3 Ti phase is brittle, it is easy to create crack in the cooling process due to the heat stress. After A1-Si co-infiltration at 620℃, the phases of the coating are Al3 Ti and Ti5Si3. The interface is clear but unsmooth.

关 键 词：渗铝 铝硅共渗 微晶 钛合金薄板 

分 类 号：TG156.8[金属学及工艺—热处理]