封装基板过孔电特性建模方法  

Modeling the electrical characteristics of via-holes in package substrate

作　　者：杨玲玲[1] 孙玲[1] 孙海燕[1] 王圣龙[1] 

机构地区：[1]南通大学江苏省专用集成电路设计重点实验室,江苏南通226007

出　　处：《电子元件与材料》2012年第1期51-54,共4页Electronic Components And Materials

基　　金：国家自然科学基金资助项目(No.61040032);江苏省研究生科技创新资助项目(No.CXZZ11-0636);南通大学研究生科技创新资助项目(No.ykc11055)

摘　　要：基于电路二端口网络理论,建立了过孔电学特性等效电路模型,给出了模型参数的提取过程。在分析比较物理模型和经验模型两种不同的模型参数提取方法及其优缺点的基础上,给出了过孔高频特性的经验模型及其模型参数。为验证经验模型的有效性,提出了基于仿真的快速验证方法。实验结果表明,该方法避免了实物测试验证所带来的测试误差,同时为降低建模成本提供了新思路。Based on the two-port network theory, an equivalent circuit model describing the electrical properties of via-holes was established and the way to extract model parameters was presented. Through analyzing and comparing the parameter extraction methods used for physical model and empirical model, an empirical model describing the high-frequency performance of via-holes was built and the related parameters were given. In order to verify the validity of the empirical model, a rapid verification method based on simulation was proposed. The results show that this verification method not only avoids the formation of measurement errors, but also reduces the cost for modeling.

关 键 词：电子封装基板 过孔 等效电路 参数提取 

分 类 号：TN312[电子电信—物理电子学]