退火温度对纳米多孔金微米线热导率的影响(英文)  

Thermal Conductivity of Nanoporous Gold Microwires at Different Annealing Temperatures

作　　者：王建立[1,2,3] 李晟[4] 夏热[4] 张兴[3] 陈云飞[1,2] 

机构地区：[1]东南大学机械工程学院,南京210096 [2]东南大学江苏省微纳医疗器械设计与制造重点实验室,南京210096 [3]清华大学热科学与动力工程教育部重点实验室,北京100084 [4]武汉大学能源与机械学院,武汉430072

出　　处：《纳米技术与精密工程》2012年第1期30-35,共6页Nanotechnology and Precision Engineering

基　　金：国家重点基础研究发展计划(973计划)资助项目(2011CB707605);国家自然科学基金资助项目(50776017,50730006,50875047,51106029);水力机械过渡过程教育部重点实验室开放研究基金资助项目

摘　　要：采用T形探针法测量了纳米多孔金微米线的热导率.实验结果表明,热导率随着退火温度的升高而减小.如果只考虑孔隙率及金孔壁宽度的影响,根据已有模型计算得到的热导率将大于实验结果.纳米多孔金结构的形态学分析显示,随着退火温度的升高,纳米多孔金的孔壁宽度增大,从而可能导致孔壁内部的拉应力增加.内部拉应力将引入纳米结构缺陷,进而使得电子与缺陷之间的散射增强,最终降低了纳米多孔材料的热导率.The thermal conductivity of nanoporous gold microwires was measured using T type probe method. A reduction in thermal conductivity was observed as annealing temperature increases. Taking the effect of porosity and ligament diameter into consideration, the thermal conductivity calculated by the con- ventional models will be larger than the experimental results. The morphological analysis shows that liga- ment coarsens during the annealing process, and the tensile stress in ligament is expected to increase with the increase of annealing temperature. The present result can be possibly explained by the defects in nanostructures ascribed to the tensile stress, which will cause the electron collisions to reduce the thermal conductivity in nanoporous materials.

关 键 词：退火温度 纳米多孔金微米线 拉应力 热导率 

分 类 号：TB383.1[一般工业技术—材料科学与工程]