高强高导CuCr合金的显微组织与性能研究  

Research on Properties and Microstructures of CuCr Alloy of High Strength and High Conductivity

作　　者：谢明[1,2] 张吉明[1] 王松[1] 恭恬洁[1] 杨有才[1] 程勇[1] 刘满门[1] 陈永泰[1] 余建树[1] 史庆南[2] 王塞北[1] 

机构地区：[1]昆明理工大学材料科学与工程学院,昆明650224 [2]昆明贵金属研究所稀贵金属综合利用新技术国家重点实验室,昆明650106

出　　处：《电工材料》2011年第4期10-13,共4页Electrical Engineering Materials

摘　　要：采用粉末冶金烧结挤压工艺成功制备出高强高导Cu_1.5Cr合金材料,对合金的显微组织、物相组成、力学与电学性能等进行了研究。结果表明,合金基体组织晶界处存在富铜铬的未溶相。Cu_1.5Cr合金抗拉强度为670 MPa,延伸率为11%,软化温度为500℃,导电率为86%IACS。合金断口呈现出大量的延性韧窝,断裂方式为典型的塑性断裂。Cu-l.5Cr alloy with high strength and high conductivity was successfully pre- pared by powder metallurgical technology. The microstructure, phase content, mechanical and electrical properties were studied. The results show that there are unsoluble phases in grain boundary of the matrix. The tensile strength, elongation rate, the softening tem- perature and the conductive rate of the Cu-1.5 Cr alloy are 670 MPa, 11%, 500＂C and 86%IACS, respectively. The SEM image of fractured surface presents a large number of ductile fracture toughness nests, and the fracture mode is typical plastic fracture.

关 键 词：高强高导铜合金 粉末冶金 显微组织 性能 

分 类 号：TM201.4[一般工业技术—材料科学与工程]