紫铜基体上组合电刷镀厚镍层的工艺  

Multi-brush plating process for thick nickel coating on pure copper substrate

作　　者：廖磊[1] 刘锦云[1] 张书[1] 韩天龙[1] 徐海森[1] 

机构地区：[1]西华大学材料科学与工程学院,四川成都610039

出　　处：《电镀与涂饰》2012年第1期23-25,共3页Electroplating & Finishing

摘　　要：研究了快速镍、低应力镍刷镀时间对紫铜表面镍镀层的厚度、显微硬度及结合强度的影响。单层快速镍及单层低应力镍较适宜的刷镀时间为15～20min。采用15min快速镍与15min低应力镍交替组合刷镀镍,所得镍镀层的厚度、显微硬度及耐淬火次数分别达50μm、400HV及46次,镀层组织清晰而均匀,镀层与镀层之间、镀层与基体之间结合良好,符合理想厚镍镀层的性能要求。The effects of fast and low-stress nickel brush plating time on the thickness, microhardness, and adhesion strength of nickel coating on pure copper substrate were studied. The suitable brush plating time for single-layer fast or low-stress nickel coating is 15-20 min. The thickness, microhardness, and quenching resistance of the coating obtained by brush plating fast and low-stress nickel coatings for 15 min alternately is up to 50 gm, 400 HV, and 46 times respectively. The structure of the coating is clear and uniform, and the adhesion between coatings or between coating and substrate is good, meeting the performance requirements of ideal thick nickel coating.

关 键 词：紫铜 电刷镀镍 厚度 显微硬度 结合力 

分 类 号：TQ153.12[化学工程—电化学工业]