去合金化Mn-Cu合金制备纳米多孔铜及其形貌演化研究  

Preparation and Microstructure Evolution of Nano-porous Copper Through Dealloying of Mn-Cu Alloy

作　　者：郑继伟[1] 张世超[1] 刘文博[1] 邢雅兰[1] 

机构地区：[1]北京航空航天大学材料科学与工程学院,北京100191

出　　处：《热加工工艺》2011年第24期40-43,共4页Hot Working Technology

摘　　要：在不同腐蚀介质中研究了化学及电化学去合金化Mn-Cu合金制备纳米多孔铜(NPC)条件及其形貌演化规律。结果表明,腐蚀介质对纳米多孔铜形成有显著影响,酸性强弱会直接改变孔径大小,在酸性更弱的有机酸中由于配合物的形成,在表面获得规则球状结构。Mn-Cu合金去合金化演化行为研究显示区域腐蚀、均一多孔演化以及多孔结构粗化构成整个去合金化过程。此外,进一步研究发现电化学电位同样对纳米多孔形貌影响显著,-0.2 V及0V可选择性腐蚀掉Mn原子,形成均一多孔结构,而0.2 V下Mn、Cu原子的共同溶解导致非多孔形貌的产生。The preparation and microstructure evolution of nano-porous copper （NPC） was systematically studied through chemical or electrochemical dealloying of Mn-Cu alloy ribbons in different corrosive medium. The results show that the corrosion medium has significant effect on the formation of nano-porous structure, in which the intensity of acidity will markedly affect the pore size, and spherical structure on the surface of samples can be obtained by dealloying in organic acid solution. Evolution behavior shows the dealloying experiences： partial alloy corrosion, homogeneous porosity evolution and the coarsening of porous structure. Besides, nano-porous morphology is remarkably influenced by electrochemical potential. Specifically, Mn atoms are selectively etched away between -0.2 V and 0 V, which results in the formation of nano-porous copper with a homogenous structure, whereas at 0.2 V potential, both Mn and Cu atoms could be dissolved away and non-oorous morohologv is obtained.

关 键 词：去合金化 纳米多孔铜 Mn-Cu合金 腐蚀介质 电化学电位 

分 类 号：TG145[一般工业技术—材料科学与工程]