电沉积钨及钨合金涂层的研究进展  

Research Development of Electrodeposited Tungsten and Tungsten Alloys Coating

作　　者：刘其宗[1] 张迎春[1] 刘艳红[1] 李绪亮[1] 江凡[1] 葛昌纯[1] 

机构地区：[1]北京科技大学材料科学与工程学院,北京100083

出　　处：《材料导报》2012年第1期142-146,共5页Materials Reports

基　　金：国际热核聚变实验堆(ITER)计划专项(2010GB109002);国家自然科学基金(50972008)

摘　　要：金属钨及含钨涂层具有优良的性能,如高熔点、高硬度、良好的化学稳定性和较低的热膨胀系数,在多个领域被广泛应用,金属钨及含钨涂层有很多制备方法,其中电沉积法具有重要的地位。综述了熔盐电沉积钨涂层及溶液电沉积钨合金涂层的研究进展,并展望了熔盐电沉积钨涂层及溶液电沉积钨合金涂层的发展趋势。Tungsten and tungsten alloy coatings have excellent properties, such as high melting point, high hardness, well-known chemical stability and low heat expansion. Tungsten and tungsten alloy coatings are widely applied for many fields. The electrodeposition of tungsten and tungsten alloy coatings shows an important position among the preparation methods for preparing these coatings. The recent progress of electrodeposited tungsten and tungsten alloys is overviewed, and the development trends of electrodeposited tungsten and tungsten alloys are also presented.

关 键 词：电沉积 钨涂层 钨合金 

分 类 号：TB383[一般工业技术—材料科学与工程]