引出结构对叠层片式电感器可靠性影响的研究  

Study on the effect of lead structure on the reliability of MLCI

作　　者：丁晓鸿 樊应县 施威 曹华春 高永毅 

机构地区：[1]深圳振华富电子有限公司,广东深圳518109

出　　处：《电子元件与材料》2012年第2期61-63,67,共4页Electronic Components And Materials

基　　金：广东省科学技术厅资助项目(No.2009A080204005)

摘　　要：叠层片式电感器(MLCI)其引出结构在热应力冲击下,可能会形成开路,降低了MLCI的可靠性,进而影响到电子线路的整体功能。针对实际应用过程中一例叠层片式电感器(型号CH1608H22N)的失效,采用X射线检查、金相检查等分析方法对电感器的失效机理进行了分析。结果表明引出电极与内电极结合部位的热致失效导致了开路,进而研究了引出结构对MLCI可靠性的影响,设计出了一种新的圆弧型引出结构,通过实验验证该结构的耐流特性比直角型引出结构的提高了50%,产品可靠性得以改善。The lead structure of multilayer chip inductor （MLCI） is open under the impact of thermal stress, which may reduce the reliability of MLCI, and then influence the whole function of electronic circuit. Aiming at a failure MLCI（model CH1608H22N） in practical application, the failure mechanism of the inductor was analyzed by X-ray examination, metallographic examination and other analytical methods. The results show that the open circuit is caused by thermally induced failure of the combination part of lead electrode and inner electrode. Then the effect of lead structure on the reliability of MLCI was investigated, and a new arc-lead structure was designed. It is validated that the current-shock resistant characteristic of this arc-lead structure is increased by 50% than that of right angle type by experiment. The reliability of products is improved.

关 键 词：引出结构 引出电极 内电极 电感器 可靠性 

分 类 号：TM53[电气工程—电器]