微波多层电路过孔特性测量方法研究与实现  

Research and Implementation of Characteristic Measurement for Via Holes in Microwave Multilayer Circuits

作　　者：田雨[1] 童玲[1] 

机构地区：[1]电子科技大学自动化工程学院,成都611731

出　　处：《电子科技大学学报》2012年第1期60-64,共5页Journal of University of Electronic Science and Technology of China

基　　金：电子测试技术国家重点实验室基础研究基金(6143902)

摘　　要：使用矢量网络分析仪测量过孔结构存在测量仪器和被测件连接不匹配、测量结果需要嵌入等困难,通过对过孔结构特性进行研究,提出了实现过孔特性测量相关的被测件、测试夹具、连接结构、边界条件实现、校准件的设计和去嵌入方法,并对完全电边界条件下的过孔结构进行了加工测量,测量频段从10 MHz～20 GHz,从测量结果的对比可以看出测量连接和夹具的影响已被去除,获得了更准确地反映过孔特性的测量结果。Considering the difficulty inherent in the measurement of via holes with vector network analyzer the measurement of via hole structures.The design of device under test,test fixture,test connection,boundary conditions,calibrations,and the de-embedding method are presented and experimented actually,the operating frequency covers from 10 MHz to 20 GHz.Comparison with former result,the advert side-effects caused by test connection and fixture has been removed,and furthermore,the more accurate characteristic of via holes can be acquired.

关 键 词：去嵌入 夹具 微波多层电路 散射参数 过孔 

分 类 号：TP206[自动化与计算机技术—检测技术与自动化装置]