有机硅/环氧树脂耐高温封装胶的制备  

Heat resistance epoxy/organosilicon packaging adhesive

作　　者：裴昌龙[1] 陈清[1] 钟桂云[1] 陶杰[1] 邵均林[1] 

机构地区：[1]浙江省化工研究院有限公司,杭州310023

出　　处：《化工新型材料》2012年第1期134-136,共3页New Chemical Materials

摘　　要：以γ-缩水甘油醚氧丙基三甲氧基硅烷为原料,通过水解缩聚制备出有机硅树脂,并与环氧树脂杂化,使用间苯二胺/聚酰胺作为固化剂。研究结果表明:当环氧树脂与有机硅树脂的质量比为7∶3,固化剂用量为16%时,所制备封装胶的剪切强度为17.23MPa,硬度为37.2N/mm2,与单纯的环氧树脂相比,合成的有机硅树脂能提高胶的热分解温度,表明该导热封装胶的综合性能得到提高。Organosilicon resin was synthesized from γ-（glycidoxypropyl） trimethoxysilane（KH-560） through the hydrolytic polycondensation,Then organosilicon/epoxy adhesive was cured by metaphenylene diamine/polyamide.It was found that when molar ratio of epoxy resin to organosilicon resin was 7：3,mass ratio of curing agent was 16%,adhesive strength was 17.23 MPa,hardness was 37.2 N/mm2,thermal decomposition temperature of organosilicon/epoxy adhesive was higher than cured product of epoxy resin.It can be concluded that this adhesive had better combination properties.

关 键 词：有机硅树脂 胶粘剂 剪切强度 

分 类 号：TQ437[化学工程]