蓝宝石晶片加工表面质量检测方法综述  

Review of the methods of surface damage inspection for grinded sapphire substrate

作　　者：王吉翠[1] 邓乾发[1,2] 周兆忠[1,3] 李振[1] 袁巨龙[1,2] 

机构地区：[1]特种装备制造与先进加工技术教育部/浙江省重点实验室,杭州310014 [2]湖南大学国家高效磨削工程技术研究中心,湖南长沙410082 [3]衢州学院,浙江衢州324000

出　　处：《超硬材料工程》2011年第5期51-55,共5页Superhard Material Engineering

基　　金：国家自然科学基金重点项目(50535040)资助

摘　　要：蓝宝石(α-Al2O3)晶体因其具有硬度高、熔点高等优良特性而在国防、航空航天、工业以及生活领域都得到广泛应用,蓝宝石晶片加工质量对其应用有着重要的影响。文章总结了蓝宝石晶片加工表面损伤常用的检测方法,并比较分析了这些检测方法的优缺点,提出了适用于加工需要的蓝宝石晶片表面损伤快速检测方案。Sapphire crystal is used extensively for national defense,industry,the field of life and so on because of its excellent characters such as high hardness and melting point.The Grinded sapphire substrate quality has important influence on its application.In this paper,the usually methods of surface damage inspection for grinded sapphire substrate are introduced.Their advantages and disadvantages are also compared and analyzed.Then the rapid detection projects which are suitable for sapphire surface damage are put forward.

关 键 词：蓝宝石晶片 表面损伤 检测 

分 类 号：TQ164.2[化学工程—高温制品工业]