前处理对化学沉镍金金面外观影响的研究  

Study on impact of different pre-treatments on gold surface appearance in electroless Nickel immersion gold process

作　　者：邓银[1] 张胜涛[1] 苏新虹 陈臣 金轶[3] 何为[3] 

机构地区：[1]重庆大学化学化工学院,重庆400030 [2]珠海方正印刷电路板发展有限公司,广东珠海519173 [3]电子科技大学微电子与固体电子学院,四川成都610054

出　　处：《印制电路信息》2011年第11期42-45,51,共5页Printed Circuit Information

摘　　要：前处理方式对印制电路板化学沉镍金工艺的金面外观影响很大,借助SEM及台阶测试仪,从铜面的微观结构及粗糙度两方面分析了尼龙刷磨刷、火山灰磨刷、喷砂、化学微蚀等前处理方式对铜面的粗化效果。研究了组合前处理方式对铜面粗化效果的影响及铜面粗化效果与金面外观的关系。结果表明,化学微蚀或喷砂+化学微蚀的组合前处理方式有利于获得较好的金面外观。Pre-treatment has great impact on gold surface appearance of printed circuit board in Electroless Nickel Immersion Gold（ENIG） process.By using scanning electron microscope（SEM） and Alpha-step IQ surface profiler,roughening effect of pre-treatments,including bristle brush scrubbing,pozzolana scrubbing,pumice,chemical micro-etching impacting,were analyzed from microcosmic structure and roughness of copper surface.At the same time,impact of combination pre-treatments on roughening effect of copper surface and the connection between roughening effect of copper surface and gold surface appearance were studied.The results show that,copper surface pretreated by single chemical micro-etching or pumice combination with chemical micro-etching are propitious to obtain better gold surface appearance.

关 键 词：前处理 粗糙度 化学沉镍金 金面外观 

分 类 号：TN41[电子电信—微电子学与固体电子学]