泡沫铅制备工艺研究  

Study on Preparing Technique of Foam Lead

作　　者：屈文超[1] 田庆华[1] 郭学益[1] 

机构地区：[1]中南大学冶金科学与工程学院,湖南长沙410083

出　　处：《金属材料与冶金工程》2011年第4期8-12,共5页Metal Materials and Metallurgy Engineering

摘　　要：研究了电沉积法制备泡沫铅的工艺,以聚氨酯泡沫为基体,经脱脂-粗化-除膜-导电化处理后,先预镀铜然后再电沉积铅。在预镀铜过程中,考察了阴极电流密度、异极极距、镀液温度和电镀时间对电流效率和槽电压的影响,得到了最佳的镀铜工艺参数为:阴极电流密度3.0 A/dm2、异极极距3.5 cm、镀液温度为25℃、电镀时间35 min。在电沉积铅过程中,考察了铅离子浓度、氟硼酸浓度、添加剂、阴极电流密度及温度和时间等因素对电流效率、槽电压和泡沫铅产品质量的影响,确定了最佳工艺条件为:阴极表观电流密度3.0 A/dm2、镀液温度为25℃、电镀时间30～50 min。在优化条件下制备的泡沫铅镀层结晶细密、均匀,且韧性和光亮性都较好,孔隙率高,具有三维网状结构。This paper used polyurethane foam as substrate to prepare porous lead,which included degreasing process,roughening process,conductive treatment and copper and lead electrodeposition.In copper electrodeposition process,the effects of current density,polar distance,temperature and galvanization time on current efficiency and cell voltage were investigated.The optimum experimental conditions were obtained as：cathode electric current density 3.0 A/dm2,polar distance 3.5 cm,temperature 25 ℃ and galvanization time 35 min.In lead electrodeposition process,the effects including solution composition,the cathodic current density,temperature,time on the current efficiency,cell voltage and the morphology of foam lead were tested.The optimum experiment conditions were obtained as：cathode electric current density 3.0 A/dm2,plating temperature 25 ℃,and galvanization time 30~ 50 min.Under optimum conditions,foam lead with three dimensional reticulated structure,high porosity,good toughness and luster plating layer could be obtained.

关 键 词：泡沫铅 电镀 聚氨酯泡沫 

分 类 号：TG146.12[一般工业技术—材料科学与工程]