高频混压多层板散热性能的局限与改善  

Limitation and improvement of thermal management on high frequency mixed-laminated multilayer PCB

作　　者：李瑛[1] 陈苑明[1] 何为[1] 黄云钟 张佳 赵丽[3] 付红志[3] 刘哲[3] 

机构地区：[1]电子科技大学应用化学系,四川成都610054 [2]重庆方正高密电子有限公司,四川重庆401332 [3]中兴通讯股份有限公司,广东深圳18057

出　　处：《印制电路信息》2012年第2期49-52,共4页Printed Circuit Information

摘　　要：印制电路板的散热效果直接影响高频多功能电子产品的可靠性。基于混压高频子板的多层印制电路板,其散热性能受到设计、制造材料与工艺的限制。本文简述了大功率元器件引发高频混压多层板的热问题,探讨了高频混压多层板散热方法及其局限,提出改善高频混压多层板散热性能的有效方法。The reliability of high frequency（HF） and multifunction electronic products were directly affected by the thermal property of PCB.The thermal effects of HF Mixed-Laminated multilayer PCB could be confined with the design,materials and manufacturing processes.The thermal problems of HF Mixed-Laminated multilayer PCB could be induced by electronic large-power components.Traditional thermal dissipation was so limited in HF Mixed-Laminated multilayer PCB that the improvement of heat dissipation was introduced.

关 键 词：高频混压 散热 环氧树脂 金属基 埋铜 

分 类 号：TN41[电子电信—微电子学与固体电子学]