分级金手指工艺研发浅谈  

A special panel of new technological process development

作　　者：张晃初 龚选丽 龚俊 赵启祥 刘师锋 

机构地区：[1]胜宏科技(惠州)有限公司,广东惠州516211

出　　处：《印制电路信息》2012年第2期64-67,共4页Printed Circuit Information

摘　　要：为了适应电子产品功能的多样化、便携化的发展要求,印制电路板不仅出现高孔径比、精细线路的高紧密特征,更是出现一些特殊结构的板件,对于分级金手指选化板,用传统的成型或蚀刻的方法无法将引线完全去除。本文介绍一种用选化干膜做分级金手指板的特殊工艺。解决以上板件无法生产的难题,拓展了常规方法所无法得特、殊订单制作。To meet the multifunction and the mobility demand,PCB not only migrated to high aspect radio,but also fine line and special structure.For the different classified gold fingers board with selective immersion gold,the traditional method of forming or etching could entirely clear the residues This paper introduced a kind of process to do with the classification of gold finger of the selected technology to solve the above challenge which solved the problem and can deliver the orders.

关 键 词：分级金手指选化板 特殊工艺 

分 类 号：TN41[电子电信—微电子学与固体电子学]