SIS型热熔压敏胶的粘接性能及动态流变行为研究  

Study on bonding properties and dynamic rheological behavior of SIS-hot melt pressure sensitive adhesive

作　　者：吴传芬[1] 范萍[1] 李文林[1] 刘鹏波[1] 

机构地区：[1]高分子材料工程国家重点实验室,四川大学高分子研究所,四川成都610065

出　　处：《中国胶粘剂》2012年第1期20-23,共4页China Adhesives

基　　金：国家自然科学基金国际合作与交流项目(50911120034)

摘　　要：以SIS(苯乙烯-异戊二烯-苯乙烯三嵌段共聚物)作为基体树脂制备HMPSA(热熔压敏胶)。研究了不同类型增塑剂与SIS基体的相容性对压敏胶(PSA)性能及动态流变行为的影响,并探讨了PSA性能与动态流变行为之间的关系。结果表明:当增塑剂与SIS中PS(聚苯乙烯)相的相容性较好时,相应HMPSA在低频(1 Hz)时的储能模量较低,初粘力较好;当增塑剂与SIS中PI(聚异戊二烯)相的相容性较好时,相应HMPSA在高频(100 Hz)时的损耗模量较高,剥离强度较大。With SIS（styrene-isoprene-styrene trihlock eopolymer） as matrix resin,a HMPSA（hol meh pressure sensitive adhesive） was prepared. The influences of eompatibility between different types of plasticizers and SIS were investigated on properties and dynamic theological behavior of PSA （pressure sensitive adhesive）,and the relation between properties and dynamic rheological behavior of PSA was discussed. The resuhs showed that Ihe corresponding HMPSA had lower storage modulus and better initial lack at low-frequency（1 Hz） when the compatibility between plasticizer and PS（polystyrene） phase from SIS was better. The corresponding HMPSA had higher loss modulus and peeling strength at high-frequency（ 100 Hz） when the compatibility between plaslieizer and PI（polyisoprene） phase from SIS was better.

关 键 词：苯乙烯-异戊二烯-苯乙烯三嵌段共聚物 热熔压敏胶 剥离强度 初粘力 动态流变行为 储能模 量 损耗模量 

分 类 号：TQ436.4[化学工程] TQ436.3