低温环境模拟舱室门封构件的热设计与优化  

Design and optimization of door seals of low-temperature environment simulator

作　　者：唐超隽[1] 吴静怡[1] 黄永华[1] 徐烈[1] 许煜雄[1] 李素玲[1] 张良俊[1,2] 

机构地区：[1]上海交通大学制冷与低温工程研究所,上海200240 [2]上海宇航系统工程研究所上海市空间飞行器机构重点实验室,上海201108

出　　处：《低温与超导》2012年第2期6-10,共5页Cryogenics and Superconductivity

基　　金：上海市科学技术委员会资助(06dz22105);上海航天基金(HTJ10-13)

摘　　要：低温环境模拟舱室(设计温度为-205℃～+100℃)的设计关键是尽量减少舱室对外各个接口处的漏热,尤其是门封处。文中针对低温舱室多种门封构件进行了漏热分析,确定了合适的门封构件。为减少漏热,在门封构件内加入液氮热沉,以吸收外部的漏热,减小向内部的漏热。完成了液氮盘管搭接位置的设计,大大减少了外部对内部的漏热量。The key point of designing a low -temperature environment simulator （designing temperature between -205℃ and 100℃ ） is to lower the heat flow through connector, especially through door seals. The best door seal structure was determined from several structures by thermal analysis. A liquid nitrogen heat sink was lapped on the door seal to absorb the heat flow. The heat flow can be great decreased by calculating and optimizing the location of the liquid nitrogen coil.

关 键 词：低温环境模拟舱室 门封设计 优化 

分 类 号：TQ414[化学工程]