注射工艺参数对超薄导光板翘曲影响的模拟  

Simulation of Effects of Injection Process Parameters on Warpage of Ultra-thin Light-guide Plates

作　　者：董鹏伟[1] 赵中里[1] 张亚军[1] 吴大鸣[1] 

机构地区：[1]北京化工大学塑料机械及工程研究所,北京100029

出　　处：《塑料》2012年第1期98-100,共3页Plastics

摘　　要：翘曲是影响导光板质量的主要原因之一。利用正交模拟的方法,同时进行方差分析,得到影响超薄导光板翘曲变形最主要的因素为保压压力。影响翘曲变形程度的工艺参数依次是保压压力、模具温度、注射速度、熔体温度和保压时间。通过调节工艺参数,可以使导光板获得较小的翘曲变形。通过对生产情况进行模拟,可以对生产工艺的优化提供一定的帮助。Warpage was one of the factors that affecting the quality of light-guide plate. Orthogonal simulation was used to obtain the most important factor that affect the warpage level was holding pressure. The parameters that affecting the warpage were holding pressure, mold temperature, injection speed, melt temperature and holding time. Smaller warpage could be acquired by adjusting process parameters. Optimization of production process could be helped by simulating the actual situation.

关 键 词：注射 工艺参数 导光板 翘曲 模拟 

分 类 号：TP391.72[自动化与计算机技术—计算机应用技术]