Electrochemical Migration Behaviors of Lead-Free 64Sn-35Bi-1Ag Solder on FR-4 PCB Board Plated with Cu  

作　　者：HUA Li HOU Hanna 

机构地区：[1]School of Chemistry and Life Science, Hubei University ofEducation, Wuhan 430205, Htlbei, China [2]School of Chemistry and Chemical Engineering, HuazhongUniversity of Science and Technology, Wuhan 430074, Hubei,China

出　　处：《Wuhan University Journal of Natural Sciences》2012年第1期79-85,共7页武汉大学学报（自然科学英文版）

基　　金：Supported by the National Natural Science Foundation of China (NSFC)(51171068);the Vital Fund from Hubei Provincial Department of Education ( C2010071);the Fund of the Vital Subject Program on Applied Chemistry in Hubei University of Education

摘　　要：Electrochemical migration （ECM） characteristic is a new reliability failure. A parallel surfacial electrode system coupling with scanning electron microscope （SEM）, energy dispersive X-ray analysis （EDAX）, and X-ray Diffraction （XRD） technologies is designed to research ECM behavior of 64Sn-35BilAg （SBA） solder in 3.5 g/L NaCl solution and compare to that of Sn37Pb and Sn-3.0Ag-O.5Cu （SAC） solders. Results show that SBA solder is more susceptible to ECM failure than Sn37Pb solder, which is more difficult than SAC solder. The affected factors of ECM are given as follows： the solder compositions, the loaded electric field, ECM time, etc. The electrochemical reaction mechanism of ECM process is achieved. EDAX and XRD analyses show that the main contents on dendrites of SBA solder after ECM test are Sn, hardly any Bi, a little Ag, which illustrates that the order of ion migration capacity is shown as follows： Sn 〉 Ag 〉Bi.Electrochemical migration （ECM） characteristic is a new reliability failure. A parallel surfacial electrode system coupling with scanning electron microscope （SEM）, energy dispersive X-ray analysis （EDAX）, and X-ray Diffraction （XRD） technologies is designed to research ECM behavior of 64Sn-35BilAg （SBA） solder in 3.5 g/L NaCl solution and compare to that of Sn37Pb and Sn-3.0Ag-O.5Cu （SAC） solders. Results show that SBA solder is more susceptible to ECM failure than Sn37Pb solder, which is more difficult than SAC solder. The affected factors of ECM are given as follows： the solder compositions, the loaded electric field, ECM time, etc. The electrochemical reaction mechanism of ECM process is achieved. EDAX and XRD analyses show that the main contents on dendrites of SBA solder after ECM test are Sn, hardly any Bi, a little Ag, which illustrates that the order of ion migration capacity is shown as follows： Sn 〉 Ag 〉Bi.

关 键 词：64Sn-35Bi-lAg （SBA） solder electrochemical migration dendrites growth fractal regulation 

分 类 号：O646.2[理学—物理化学]