基于印刷工艺的介质层绝缘特性研究  

Insulation Improvement of Screen-Printed Dielectric Films by Double-Sintering

作　　者：林贺[1] 叶芸[1] 肖晓晶[1] 杨帆[1] 陆培民[1] 郭太良[1] 

机构地区：[1]福州大学物理与信息工程学院,福州350002

出　　处：《真空科学与技术学报》2012年第2期104-108,共5页Chinese Journal of Vacuum Science and Technology

基　　金：国家"863"重大专项资助项目(2008AA03A313);福建省自然科学基金资助项目(2009J05145);场致发射显示技术教育部工程研究中心开放基金项目(KFJJ1009)

摘　　要：绝缘介质层是三极场致发射显示器的重要组成部分,本文通过丝网印刷技术与一次烧结和重复烧结两种烧结工艺制备不同膜厚的介质层,利用台阶仪和扫描电子显微镜分别对介质层膜厚和形貌进行表征,并对介质层的绝缘耐压性能进行了测试。结果表明,在重复烧结工艺下制备的膜厚约为34μm的介质层的耐压特性较好,电场强度达0.15 MV/cm,可耐压421 V,漏电流小,且重复性好,基本上可以满足后栅型FED栅极调控电压对介质层耐压性能的要求。同时在电场较弱时,介质层漏电流的输运符合欧姆输运机制;随着电场的升高,介质层漏电流的输运以Schottky发射机制为主,Frenkel-Poole发射机制对漏电流的影响很小。The dielectric films,to be used in fabrication of field emission display,were deposited by screen printing on glass substrates.The impacts of sample preparation,including the sintering conditions,numbers of screen-printing and sintering times,and film thickness,on its insulation property was studied.The microstructures of the films were characterized with scanning electron microscopy and conventional surface probes.The results show that the repeated sintering significantly improves the insulation property.For instance,when films were sintered twice in two different stages,the breakdown voltage of a 34 μm thick films was found to be 421 V,accompanied by negligible leakage current.When it comes to the conduction mechanisms,in a low field,Ohm＇s law works;whereas in a high field,Schottky emission dominates.

关 键 词：丝网印刷 介质层 绝缘特性 

分 类 号：TN104[电子电信—物理电子学]