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作 者:姜涛[1] 赵清亮[1] 樊荣伟[2] 董志伟[2] 于欣[2] 李卫波[1]
机构地区:[1]哈尔滨工业大学精密工程研究所,黑龙江哈尔滨150001 [2]哈尔滨工业大学可调谐(气体)激光技术国家级重点实验室,黑龙江哈尔滨150080
出 处:《红外与激光工程》2012年第2期387-392,共6页Infrared and Laser Engineering
基 金:高档数控机床与基础制造装备科技重大专项(2009ZX01001-151);新世纪优秀人才支持计划(NCET-07-0246);中国博士后科学基金(20090451006)
摘 要:采用飞秒激光微加工系统对宽带隙陶瓷材料SiC和Al2O3诱导微结构时的去除机理及烧蚀特性进行了研究。应用扫描电子显微镜、粗糙度轮廓仪、光学显微镜和能量色散谱仪等对烧蚀的微观形貌和化学组成进行了评价,得出加工SiC时强烧蚀和轻烧蚀的破坏阈值分别为0.61 J/cm2和0.13 J/cm2。同时获得了加工参数与烧蚀形貌之间的关系,发现材料的去除机理强烈依赖于入射激光的脉冲能量,并对二者的关联机制进行了分析。探讨了表面粗糙度和掺杂在材料中的不同元素对烧蚀结果的影响。从而为在难加工类宽带隙陶瓷材料表面加工高质量的微结构提供了有力的理论依据和技术支持。Material removal mechanisms and ablation characteristics were studied by using femtosecond laser micro-machining system induced microstructures on the surfaces of wide band gap ceramic materials,i.e.SiC and Al2O3.Scanning electro microscopy(SEM),talysurf profilometer,optical microscopy(OM) and energy dispersive spectrometer(EDS) were used to evaluate the samples′ morphology and chemical compositions.Gentle and strong damage thresholds for two different etch phase were 0.13 J/ cm2 and 0.61 J/ cm2,respectively.The function of modification parameters and micro-topography were obtained,and the material removal mechanisms strongly depended on the applied energy fluency.Besides,the different elements compositions and surface roughness values of samples affect the morphology of ablation zones were also studied.All of the results provide significant theoretical and technical support for processing high-quality microstructures by femtosecond laser on wide band gap hard-to-machine ceramics.
分 类 号:TN249[电子电信—物理电子学]
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