镍-铜复合镀层Kevlar纤维的研制  

Development and Research of Electroless Ni-Cu Plated Kevlar Fibers

作　　者：梁晶晶[1] 邹新国[1] 张慧茹[1] 邵勤思[1] 唐志勇[1] 孙晋良[1] 

机构地区：[1]上海大学材料科学与工程学院复合材料研究中心,上海200072

出　　处：《高分子材料科学与工程》2012年第3期148-152,共5页Polymer Materials Science & Engineering

基　　金：国家自然科学基金资助项目(51103083);上海市重点学科建设项目资助(s30107);上海市科委纳米专项(0852nm00600);上海大学创新基金(SHUCX101003)

摘　　要：采用化学镀技术制备了镍-铜复合镀层的导电Kevlar纤维。进行了自制金属化试剂对Kevlar纤维的粗化处理,研究了镍镀层含量、添加剂聚乙二醇(PEG6000)和亚铁氰化钾(K4Fe(CN)6))对化学镀铜的影响。实验表明,镍镀层质量增加率为10%较适宜继续化学镀铜;添加剂均可降低化学镀铜的沉积速度,PEG6000能够细化圆滑镀层颗粒,K4Fe(CN)6使得镀层表面平整光亮,制得光滑致密有金属光泽的铜镀层,并提高其导电性。镍-铜复合镀层Kevlar纤维的断裂强力为45 N,表面电阻为0.4Ω/cm。Electroless copper plating at the nickel modified surface of Kevlar fibers was investigated. The surface of Kevlar fibers was roughened using sodium hydride-dimethyl sulfoxide （NaH-DMSO）. Then, influence of Ni weight gain rate and additives （polyethylene glycol PEG6000 and potassium ferrocyanide K4Fe（CN）6） on electroless Cu plating was studied. The results show that favorable Ni weight gain rate is approximate 10 %, PEG6000 and K4Fe （CN）6 increase the stability of plating bath, and reduce the deposition rate of electroless Cu plating. Copper grains turn fine, sleek and homogeneous with adding PEG6000. Copper deposits become more compact, smoother and brighter with adding KaFe （CN）6. Correspondingly, the appearance of deposits changes from dark-brown to red brown, and then to bright copper. Meanwhile, the conductivity of deposits increases. The properties tests show that breaking strength of Ni-Cu coated Kevlar fibers is 45N and thesiarface resistance is 0.4Ω/cm.

关 键 词：KEVLAR纤维 粗化 化学镀镍-铜 表面电阻 表面形貌 

分 类 号：TQ342.721[化学工程—化纤工业]