电磁屏蔽填料的制备及研究进展  

Preparation and Researching Progress of Electromagnetic Shielding Packing

作　　者：张宁[1] 邵忠财[1] 李晓伟[1] 

机构地区：[1]沈阳理工大学环境与化学工程学院,辽宁沈阳110159

出　　处：《电镀与精饰》2012年第3期28-33,共6页Plating & Finishing

基　　金：辽宁省教育厅科技攻关项目(L2010484)

摘　　要：综述了电磁屏蔽导电复合填料的发展现状,分别介绍了金属系导电填料、碳系导电填料和金属-碳系导电填料的制备及研究进展。进一步分析了三种导电填料的优缺点,并对其进行了比较,同时对未来碳系填充型电磁屏蔽材料的发展趋势提出了建议。Developmental status of electromagnetic shielding conductive composite packing was summarized;preparation and researching progress of conductive filler,such as metal for conductive filler、carbon and metal-carbon for conductive filler were introduced;advantages and disadvantages of the three kinds of conductive filler were also analyzed and compared.Meanwhile,developmental trend of carbon for electromagnetic shielding packing in future was put forward.

关 键 词：电磁屏蔽 金属系导电填料 碳系导电填料 金属-碳系导电填料 

分 类 号：TG174.45[金属学及工艺—金属表面处理]