对位芳纶纸基材料的研究  

Study on para-aramid paper-based materials

作　　者：黄一磊[1] 骆思嘉[1] 

机构地区：[1]中南林业科技大学材料科学与工程学院,湖南长沙410004

出　　处：《中南林业科技大学学报》2012年第1期186-188,193,共4页Journal of Central South University of Forestry & Technology

基　　金：国家"948"项目(2009-4-51);湖南省教育厅高校产业化培育项目(11CY027);中南林业科技大学木材科学与技术国家重点学科资助项目

摘　　要：研究了间位芳纶浆粕、环氧树脂和溶剂法增强对位芳纶纸的方法,比较了它们的微观形态、机械性能和热性能。结果表明:这3种方法都能有效地增强对位芳纶纸;KS纸在机械性能、热性能上均优于KE纸和KY纸。The reinforcement effects of para-aramid paper-based materials respactively using meta-aramid fibrid, epoxy resin and by solvent method were studied. The micro morphology, mechanical and thermal properties of paper-based product were discussed. The results show that the three methods effectively enhanced the strength of the paper-based product. The mechanical properties and thermal properties of KS paper were better than KY paper and KE paper.

关 键 词：对位芳纶 纸基材料 增强效应 

分 类 号：S784[农业科学—林学] TQ342.722[化学工程—化纤工业]