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机构地区:[1]上海化工研究院电子化学品研究所,上海200062
出 处:《有机硅材料》2012年第2期87-92,共6页Silicone Material
摘 要:以烯丙基缩水甘油醚和四甲基环四硅氧烷为原料,制备加成型液体硅橡胶用含环氧基的有机硅增粘剂。用红外光谱和核磁共振氢谱对其结构进行了表征,考察了加入量对硅橡胶胶料黏度及硫化胶硬度、介电常数、介质损耗因数、绝缘电阻率、电气强度、粘接性能及封装二极管高温反向漏电流的影响。结果表明:增粘剂能提高硅橡胶的粘接强度;影响其绝缘电阻率和电气强度;降低封装二极管的高温反向漏电流;基本不影响硅橡胶胶料黏度及硫化橡胶的硬度、介电常数、介质损耗因数。A tackifier with epoxy functional groups for the addition-type liquid silicone rubber was prepared,using tetramethylcyclotetrasiloxane and allyl glycidyl ether as the raw materials.The microstructure was characterized by Fourier transform infrared spectroscopy(FT-IR) and 1H Nuclear Magnetic Resonance(1H-NMR).The effect of the tackifier amount on the viscosity of the addition-type LSR,the hardness,dielectric constant,dielectric loss factor,insulation resistivity,electrical breakdown strength,and bonding property of vulcanized silicone rubber and reverse leakage current of encapsulation diode at high temperature was investigated.The results showed that the tackifier could significantly improve the bonding strength of the vulcanized silicone rubber,affect the insulation resistivity and electrical breakdown strength of the vulcanized silicone rubber,decrease the reverse leakage current of the encapsulation diode at high temperature,and have no effect on the viscosity of the addition-type liquid silicone rubber and the hardness,dielectric constant,dielectric loss factor of the vulcanized silicone rubber.
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