黄铜化学镀锡及其形貌变化过程的研究  

A Study of Electroless Tin Plating on Brass and Change Process of the Surface Topography

作　　者：王瑀[1] 周栋[1] 丁毅[1] 马立群[1] 

机构地区：[1]南京工业大学,江苏南京210009

出　　处：《电镀与环保》2012年第2期21-23,共3页Electroplating & Pollution Control

摘　　要：讨论了黄铜化学镀锡工艺过程中氯化亚锡和次磷酸钠的质量浓度、pH值、温度以及时间对镀层沉积速率的影响,获得较好的工艺参数如下:氯化亚锡10g/L,硫脲30g/L,次磷酸钠5g/L,pH值2,60℃,4min,在此条件下获得纯锡镀层。简要分析了不同时间下黄铜表面形貌的变化情况及其原因。The effect of mass concentration of SnCl2 and Nail2 PO2, pH value, temperature and processing time on the coating depositing rate were discussed. The optimal process conditions were obtained as follows： SnCl2 10 g/L, thiourea 30 g/L, NaH2PO2 5 g/L, pH value 2, temperature 60 ℃, processing time 4 min. Under these technological conditions, a pure tin deposit was obtained. The changes of brass surface topography for different times and the reasons were analyzed in brief.

关 键 词：黄铜 化学镀锡 表面形貌 

分 类 号：TQ153[化学工程—电化学工业]