TGO均匀生长及典型界面形貌特征对热障涂层残余应力的影响  

Effect of TBC Residual Stresses by Uniform Growth of TGO and Typical Interface Topography

作　　者：韩志勇[1] 王欢[1] 丁昆英[1] 王志平[1] 

机构地区：[1]中国民航大学材料工艺技术研究所,天津300300

出　　处：《河北师范大学学报（自然科学版）》2012年第2期155-158,共4页Journal of Hebei Normal University：Natural Science

基　　金：国家自然科学基金(60879018)

摘　　要：考虑到热障涂层中陶瓷层/粘结层界面间的热生长氧化物以及粘结层的表面形貌,模拟计算了热障涂层中锥形坑对热生长氧化层与陶瓷层、粘结层界面残余应力分布.计算结果表明,形貌单元尺寸及分布密度对热生长氧化物界面应力有明显的影响,热生长氧化物层与陶瓷层界面的应力大于与粘结层界面的应力,在形貌中心处存在应力集中,并且达到最大值,形貌中心是涂层失效的危险点,其残余应力随着界面形貌单元数量的增加而减小.Using ABAQUS soft by finite element analysis method,the effect of residual stresses distribution by growth of thermally-growth oxide（TGO） that grows between TGO and bond coat interface and cone interface topography of bond coat in a TBC system was calculated.The calculating result shows that the residual stress of thermally-growth oxide interface is affected by interface topography unit size and topography distribution density obviously.The stress between TGO and top ceramic coating interface is greater than the stress between TGO and bond coat interface.Stress concentrates in topography center and reaches the maximal value.The stress decreases with the increase of topography quantity.

关 键 词：热障涂层 残余应力 界面形貌 热生长氧化物 

分 类 号：TG172.6[金属学及工艺—金属表面处理]