无铅BGA返修工艺方法  

Lead-free BGA Rework Process

作　　者：张伟 孙守红 石宝松 

机构地区：[1]长春光学精密机械与物理研究所,吉林长春110031

出　　处：《电子工艺技术》2012年第2期86-89,共4页Electronics Process Technology

摘　　要：总结了无铅BGA返修的工艺特点、技术要求和温度曲线设置方法;介绍了一种暗红外返修系统的结构与性能特点;结合实际工作详细描述了某航天产品无铅BGA返修的实施工艺,重点阐述了返修时高可靠性的实现方法;从而验证了基于此设备的工艺方法对于无铅BGA返修的有效性。Summarize the characteristics of lead-free BGA rework process, technical requirements and methods of setting temperature curve; describe the structure and performance characteristics of a IR rework system; combine with work experience, describe a product＇s implementation of lead-free BGA rework process in detail, which focuses on the repair methods of high reliability; Prove the effectiveness of the method based on this machine for lead-free BGA rework process.

关 键 词：表面贴装技术 温度曲线 返修技术 

分 类 号：TN605[电子电信—电路与系统]