CuSO_4溶液包覆Ba_2Ti_9O_(20)陶瓷介电性能的研究  

Microwave Dielectric Properties of Ba_2Ti_9O_(20) Ceramics Coated by Precursor Solution of CuSO_4

作　　者：李谦[1] 金彪[1] 黄金亮[1] 顾永军[1] 

机构地区：[1]河南科技大学材料科学与工程学院,洛阳471003

出　　处：《功能材料与器件学报》2012年第1期70-74,共5页Journal of Functional Materials and Devices

基　　金：河南省国际科技合作计划(0346620012)资助;河南省科技发展计划(092300410135)

摘　　要：以BaCO3和TiO2粉末进行固相反应来合成Ba2Ti9O20主晶相,以CuSO4溶液为先驱体引入CuO来降低瓷料的烧结温度,CuO薄层修饰陶瓷粉体表面。这种方法减少了烧结助剂的加入量从而降低了对陶瓷材料介电性能的恶化。介电常数(εr)随着CuSO4溶液浓度的增大先增大后略有减小。介电损耗(tanδ)随着CuSO4溶液浓度的增大先减小后增大。CuSO4溶液的浓度为0.32mol/l,1200℃烧结4h后得到良好的介电性能:εr=43,tanδ=0.005,τf=-7ppm/℃(1MHz)。Ba2TigO20 main phase are prepared from BaCO3 and TiO2 powders. The CuO doped by precur- sor solution of CuSO4 was used to reduce the sintering temperature of the Ba2TigO20 ceramics, modifying the surface of Ba2Ti9O20 by CuO thin layer. The process reduces the amount of sintering aid and mini- mized the negative impact of siutering aid on dielectric properties. The relative dielectric constant （ εr ） increased initially and then decreased slightly with increasing CuSO4 concentration. The dielectric loss （tanδ） decreased initially and then increased with the addition of CuSO4 solution. Good dielectric prop- erties of G = 43, tanδ= 0. 005 and Tf = - 7 ppm/℃ （1MHz） were obtained for the 0.32 mol/l Cu- SO4 concentration added Ba2Ti9O20 ceramics sintered at 1200℃ for 4 h.

关 键 词：微波介质陶瓷 介电性能 低温烧结 液相包覆 

分 类 号：TQ174[化学工程—陶瓷工业]