银基填充复合材料电磁屏蔽效能研究  

Study on the Electromagnetic Shielding Properties of Silver-based Composite

作　　者：顾哲明[1] 王萍[1] 张兆峰[1] 金石磊[1] 李小慧[1] 胡欣欣[2] 李颖 

机构地区：[1]上海材料研究所上海工程材料应用评价重点实验室,上海200437 [2]华东理工大学材料科学与工程学院,上海200237 [3]谱尼测试科技股份有限公司,上海200237

出　　处：《材料导报》2012年第6期100-102,共3页Materials Reports

基　　金：上海市纳米基金(1052nm02500)

摘　　要：银基填充复合材料作为电磁屏蔽材料是电磁屏蔽领域研究热点之一。选用片状银粉、环氧树脂及固化剂制备导电银胶,使用涂抹棒将导电银胶均匀涂覆于聚酯基板上,固化后测试其各频率波段电磁屏蔽性能。研究了银基填充复合材料膜厚在不同波段电磁屏蔽性能的差别,测试其体积电阻率,通过扫描电镜观察横截面中片状银粉分散的均匀性,推导其电磁屏蔽机理。The silver-based composite is one of the hot areas of the research on electromagnetic shielding mate-rials. Conductive silver paste was prepared by silver, epoxy resin and curing agent, and was coated on the PET sub- strate. The electromagnetic shielding properties of conductive silver paste at different wave bands was tested after cu- ring. The difference of electromagnetic shielding properties at different wave bands with different film thickness of sil- ver-based composite was studied. The volume resistivity of the material was tested and the dispersing of silver powder in the Section was observed by scanning electrical microscopy. Based on the conclusion, the electromagnetic shielding mechanism was discussed.

关 键 词：导电银胶屏蔽效能屏蔽机理 

分 类 号：TB32[一般工业技术—材料科学与工程]