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机构地区:[1]华南师范大学化学与环境学院,广东广州510006
出 处:《电镀与涂饰》2012年第4期43-47,共5页Electroplating & Finishing
摘 要:光诱导沉积技术因具有可以不用屏蔽或遮盖也能使金属离子在材料表面沉积出各种图案的优点,而成为微电子领域和光伏领域替代传统丝网印刷技术制备选择性图案或者使图案金属化的方法。本文回顾了光解型和光生电子型光诱导沉积技术的发展历程,指出了存在的问题。认为镀液稳定性研究,防扩散层与基体结合力的提高,镀层机械性能和电气性能的改善,以新的镀种取代贵金属,以及产品寿命的延长,是今后的发展方向。Light-induced deposition process has the advantages of forming various patterns by metal deposition on the surface of materials without shielding or covering, which is a method for preparation of selective pattern and metallization technique in the field of microelectronics and photovoltaic industry to replace the traditional screen- printing process. In this article, the development history and current status ofphotolysis-type and photogenerated electron type light-induced deposition methods were reviewed, and the existing problems were pointed out. It is suggested that the research on bath stability, enhancement of the adhesion between diffusion barrier and substrate, improvement of the mechanical and electrical properties of deposit, new bath substitution for noble metal bath, and extension of product service life are the directions of development of light- induced deposition in the future.
分 类 号:TQ153.3[化学工程—电化学工业]
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