半导体制冷片对电子元件降温效果的试验研究  

Experimental Study on Electronic Components Cooling Effect by Semiconductor Refrigeration

作　　者：赵培聪 袁广超[2] 陈恩[2] 钟根仔[2] 丁东旭[2] 江用胜[2] 

机构地区：[1]驻南京地区电子设备军代室,江苏南京210001 [2]合肥通用机械研究院压缩机技术国家重点实验室,安徽合肥230088

出　　处：《流体机械》2012年第3期64-66,70,共4页Fluid Machinery

摘　　要：就半导体制冷器对CPU等电子元件的降温效果进行了试验研究。通过模拟试验分别得到了CPU在传统风冷散热装置和接入半导体制冷片时的温度数据,并对比分析了CPU输入电压以及制冷片电压对降温效果的影响。结果显示,接入半导体制冷片后,CPU的工作温度大为降低,降温幅度达到15～25℃,可以很好地满足高频电子元件的温度要求;同时发现CPU的降温效果与制冷片电压并不成正比关系。The electronic components cooling effect by semiconductor refrigeration was tested by experiment in the study. The temperature data were obtained under the experimental condition of the air - cooled heat exchanger and semiconductor refrigeration. The influence of the voltage of CPU and refrigeration piece on cooling effect was also analyzed. The results showed that the semiconductor refrigeration made a CPU temperature decline of 15 to 25 degrees, which can meet the temperature requirements of high frequency electronics, and found that the CPU Cooling effect and voltage of refrigeration piece is not relation of certain direct ratio.

关 键 词：半导体制冷 CPU 降温效果 

分 类 号：TB65[一般工业技术—制冷工程]