环氧树脂/胺化酰亚胺潜伏性固化体系的制备  

Preparation of Epoxy Resin /Aminoimide Latent Curing Systems

作　　者：张有智[1] 李正莉[1] 王煊军[1] 朱建伟[1] 

机构地区：[1]第二炮兵工程学院,陕西西安710025

出　　处：《化学推进剂与高分子材料》2012年第2期59-63,共5页Chemical Propellants & Polymeric Materials

摘　　要：为了深入了解新型环氧树脂/胺化酰亚胺潜伏性固化体系的使用条件,采用差示扫描量热(DSC)技术考察了E–51型环氧树脂/脂肪族胺化酰亚胺体系的非等温固化反应过程,研究了体系的固化条件及固化物性能。结果表明:E–51与固化剂的物质的量比为1∶0.1;体系的固化条件为固化150℃/2 h,后固化180℃/1 h。树脂试样制备工艺简单,无挥发性有机溶剂,树脂混合物贮存稳定性好。体系固化反应平稳且放热量较少,完全固化后的树脂试样具有良好的耐水性、耐热性和物理机械性能。In order to deeply understand the operating conditions of novel epoxy resin/aminoimide latent curing systems,the non-isothermal curing reaction processes of E-51 epoxy resin/aliphatic aminoimide systems were investigated by using differential scanning calorimeter（DSC） technique.The curing conditions of the system and the properties of the cured products were researched.The results show that the molar ratio of E-51 to curing agent is 1：0.1,the curing condition of the system is 150 ℃/2 h,and the post curing condition is 180 ℃/1 h.The preparation processes of the resin samples are simple,VOC-free.The storage stability of resin blend is good.The curing reaction of the system is smooth,and the heat output is low.The completely cured resin samples have good water resistance,heat resistance,physical and mechanical properties.

关 键 词：环氧树脂 胺化酰亚胺 潜伏性固化剂 固化条件 固化物性能 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]