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作 者:郭崇武[1]
出 处:《电镀与精饰》2012年第4期37-38,共2页Plating & Finishing
摘 要:在电镀生产中,监控镀液中金属杂质是十分必要的。制定了酸性镀铜溶液中锌杂质的分析方法。用碘量法测定硫酸铜,用EDTA容量法测定硫酸铜和锌杂质的总量,从总量中减去硫酸铜的量得到锌杂质的质量浓度。方法准确,能够满足监控酸性镀铜溶液的要求。It is necessary to monitor the metal impurites in bath during the electroplating production.An analysis method of zinc impurity in acidic copper plating bath is established.The concentration of copper sulfate is firstly determined by using iodimetry,and then the sum of the copper sulfate and zinc impurity is determined with EDTA volumetry.The concentration of zinc is determined by the deference between copper sulfate and the sum of copper sulfate and zinc impurity.This method is exact and accurate,and can satisfy the controlling requirement of acidic copper plating solution.
分 类 号:TG115.313[金属学及工艺—物理冶金]
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