化学镀Co-Ni-P合金薄膜化学成分的考察  

Research of the Chemical Composition of Electroless Co-Ni-P Alloy Film

作　　者：宣天鹏[1] 卑多慧[1] 

机构地区：[1]合肥工业大学材料科学与工程学院,安徽合肥230009

出　　处：《电镀与精饰》2000年第3期3-5,共3页Plating & Finishing

摘　　要：考察了影响化学镀 Co-Ni-P合金薄膜化学成分的因素 ,镀液中 c Co2 + /( c Co2 + +c Ni2 + )的比值越高和总金属离子浓度越低 ,薄膜的钴含量越高 ,镍和磷的含量越低。较高的 p H值和较厚的薄膜会提高薄膜的钴含量 ,降低镍含量 ,磷元素倾向于偏聚在晶界上。Factors affecting the chemical composition of electroless Co Ni P alloy film were studied. The results show that the higher the ratio of c Co 2+ /(c Co 2+ +c Ni 2+ ) and the lower the total metallic ion concentration in the bath, the higher the cobalt content and the lower the nickel and phosphorous content of the film. The cobalt content of the film could be increased and nickel content be decreased in the condition of higher pH value of the bath and larger thickness of the film. Element phosphorous tended to segregate in grain boundary.

关 键 词：化学镀 化学成分 镀合金 镍磷钴合金 电镀 

分 类 号：TQ153.2[化学工程—电化学工业]