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出 处:《电镀与涂饰》2000年第3期21-22,共2页Electroplating & Finishing
基 金:安徽省教委基金资助项目! (项目编号 98JL0 138)
摘 要:硫酸盐光亮镀锡工艺具有电流效率高、沉积速度快、成本低及废水易处理等优点 ,在电镀生产中已广泛应用。为进一步提高镀锡层的性能 ,研制出一种多功能硫酸盐镀锡添加剂。通过赫尔槽试验优选出最佳镀液配方和工艺条件 ,并对镀液、镀层性能进行了测试。结果表明 :采用自制的多功能添加剂能明显提高镀液的稳定性 ,所得镀层光亮、致密、均匀 ,无锡须 ,结合力强 。Sulfate tin plating process has been widely used in electroplating industry for its strengths such as high current efficiency, fast plating rate, low cost and easy effluent disposal. In order to further improve the properties of tin electrodeposits, a multifunctional sulfate tin plating additive was developed. Formula and plating parameters were optimized by Hull Cell test, properties of electrolyte and tin electrodeposits were also tested. Results show that bath stability are greatly improved by adopting the self-developed multifunctional additive. Bright, compact and uniform tin deposits with no whiskers are obatined which have good adhesion, solderability and resistance to oxidation.
分 类 号:TQ153.13[化学工程—电化学工业]
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