大功率白光LED灯具散热优化方案  

Heat Dissipation Optimization of High-Power White LED Lamp

作　　者：白坤[1] 聂秋华[1] 吴礼刚[1] 戴世勋[1] 林万炯 周伯友 马湘君[1] 郑兆勇 

机构地区：[1]宁波大学信息科学与工程学院,浙江宁波315211 [2]宁波赛尔富电子有限公司,浙江宁波315103

出　　处：《照明工程学报》2012年第2期52-56,共5页China Illuminating Engineering Journal

基　　金：宁波市重大科技攻关项目(2010B10005);宁波市自然科学基金(2010A610180);浙江省公益性技术应用研究计划项目(2010C31087);宁波市科技创新团队项目(2009B21007);宁波大学王宽诚幸福基金资助

摘　　要：设计了一种大功率白光LED筒灯的实际封装结构,利用有限元软件模拟其稳态下的温度场分布,得出LED芯片最高温度为110.5℃,散热器温度范围为71.6℃～75.9℃。计算结果与实验测量结果吻合,在此基础上,根据热分析与传热学原理对模型进行材料和结构优化。最终得出一个最优化方案,使得结温降至79.0℃。An actual structural model of packaging of High-Power white LED downlights were designed.The highest temperature of LED chip is 110.489℃,and the temperature of heat-sink is 71.59℃～75.912℃ which were obtained by the analysis of steady-state temperature fields based on the simulation of the software of finite element.On the basis of approximation with experiment and statistic result.Structures of heat sink were optimized according to thermal simulation and the heat transfer theory.A optimization scheme is obtained,which shows the temperature of PN junction is only 79.0℃.

关 键 词：大功率LED 热通道 散热 优化 

分 类 号：TM923.34[电气工程—电力电子与电力传动]