冷热冲击下BGA焊接失效的分析研究  

Analysis of BGA soldering failure under cold thermal shock

作　　者：胡友作[1] 何为[1] 薛卫东[1] 黄雨新[1] 徐缓 

机构地区：[1]电子科技大学电子薄膜与集成器件国家重点实验室,四川成都610054 [2]梅州博敏电子科技公司,广东梅州514000

出　　处：《电子元件与材料》2012年第5期63-65,共3页Electronic Components And Materials

摘　　要：采用冷热冲击的方法,以温度改变率为90℃/min,温度循环范围为–65^+125℃,高低温段停留时间为15 min的条件对无铅焊接的BGA焊接位置进行可靠性测试,用金相显微镜,SEM和EDS进行表征分析。结果表明,冷热冲击下BGA的失效点多集中于焊料与焊盘间。SnAgCu焊料与焊盘以及形成的IMC之间的热膨胀系数(CTE)不匹配,还有IMC被氧化是导致在冷热冲击下BGA焊接位置失效的主要原因。Using cold thermal shocking method,the reliability of lead-free BGA soldering position was tested with the temperature change rate of 90 ℃/min,-65-＋125 ℃and the stay time of 15 min in the high and low temperatures.The analyses of the test results were performed by metallographic microscope,SEM and EDS.The results show that the failure spots of BGA are mostly concentrated between the solder and the solder pad.The main reasons caused the BGA soldering position failure are that the coefficients of thermal expansion（CTE） of IMC,the solder and solder pad mismatch and IMC get oxidized.

关 键 词：BGA焊接 失效分析 冷热冲击试验 

分 类 号：TN40[电子电信—微电子学与固体电子学]