机床卡盘体的三维充型与凝固模拟  

3-D Numerical Simulation of Mold Filling and Solidification for Lathe Chuck Plate

作　　者：曾怡丹[1] 王娜[1] 肖柯则[1] 

机构地区：[1]内蒙古工业大学,内蒙古呼和浩特市010062

出　　处：《中国铸造装备与技术》2000年第1期26-27,共2页China Foundry Machinery & Technology

摘　　要：在二维SOLAVOF法流场模拟的基础上,开发了耦合传热的三维充型软件FUL。应用FUL及TEMP(三维温度场模拟软件)对无冒口铸造的80mm机床卡盘体进行了浇注与凝固模拟,为生产控制提供了准确依据。Based on 2 D SOLA VOF,a 3 D numerical simulation software of mold filling and heat transfer of molten metal has been programed.The modeling of mold filling and casting solidification for 80mm lathe chuck plate is conducted by no riser process.lt provides for real production a precision control tool.

关 键 词：卡盘体 浇注 凝固 模拟 机床 

分 类 号：TG25[金属学及工艺—铸造]