硫酸盐还原菌对H68黄铜点蚀的影响  

The Influence of Sulfate-reducing Bacteria on Pitting of H68 Brass

作　　者：曹生现[1] 院凯延[1] 孙玲玲[1] 

机构地区：[1]东北电力大学自动化工程学院,吉林吉林132012

出　　处：《全面腐蚀控制》2012年第4期30-33,共4页Total Corrosion Control

摘　　要：本文通过自腐蚀电位技术、交流阻抗技术以及动电位极化技术等电化学技术,研究了H68黄铜在硫酸盐还原菌中的腐蚀行为,并分析了硫酸盐还原菌的腐蚀机理和腐蚀特性。由实验结果得出,随着硫酸盐还原菌代谢活动的加强,铜电极的点蚀电位和开路电位具有一定的规律,并且H68黄铜的转移电荷呈现升降升的规律。在硫酸盐还原菌中的腐蚀行为比在无菌介质中强烈。硫酸盐还原菌代谢活动能降低溶液的pH值,破坏了铜电极表面的CuO的氧化膜,加速了铜电极的腐蚀,促进了金属的点蚀发生,使铜金属点蚀敏感性增加。In this paper, the corrosion behavior of H68 brass in sulfate-reducing bacteria was studied by open-circuit potential of electrode, the electrochemical impedance spectrometry and the cyclic potention dynamic polarization these electrochemical techniques and scanning electron microscopy, also analysis the corrosion characteristics and mechanisms of sulfate-reducing bacteria. The results show that with the metabolic activity of sulfate-reducing bacteria, pitting potential and corrosion potential of copper electrode have certain regular changes, and the charge-transfer resistance of H68 brass presents the regular of rise, down and rise. The corrosion rate in sulfate-reducing bacteria medium is higher than in the sterile medium. Metabolic activity of sulfate-reducing bacteria can decrease the solution PH value, and it destroyed the CuO passivation layer of copper electrode surface, accelerated corrosion of copper electrode, promoted pitting corrosion of metal, increased the sensitivity of pitting corrosion of copper electrode.

关 键 词：硫酸盐还原菌 点蚀 黄铜 自腐蚀电位 交流阻抗 

分 类 号：TG172[金属学及工艺—金属表面处理]