Pulsed electrohydrodynamic printing of conductive silver patterns on demand  被引量:4

Pulsed electrohydrodynamic printing of conductive silver patterns on demand

在线阅读下载全文

作  者:WANG Xiangt XU Lei ZHENG GaoFeng CHENG Wei SUN DaoHeng 

机构地区:[1]Department of Mechanical and Electrical Engineering,Xiamen University,Xiamen 361005,China [2]School of Mechanical and Electric Engineering,Jingdezhen Ceramic Institute,Jingdezhen 333403,China

出  处:《Science China(Technological Sciences)》2012年第6期1603-1607,共5页中国科学(技术科学英文版)

基  金:supported by the National Natural Science Foundation of China (Grant No. 51035002);the Key Project of Chinese Ministry of Edu-cation (Grant No. 708055);the Fundamental Research Funds for the Central Universities (Grant No. 2010121039)

摘  要:Pulsed electrohydrodynamic printing (EHDP) is used to fabricate conductive silver patterns with micrometer resolution. The silver ink pendant experiences swelling, pulsation, and ejection under an applied pulse voltage of 20 Hz. The droplet deposi- tion frequency is equal to the applied voltage frequency so that the EHDP can deposit silver ink on demand. A low applied voltage favors uniform and non-scattering silver patterns while a high applied voltage results in ink scattering. Discrete drop- lets with 45-55 gm in diameter and continuous tracks with 60 gm in width are generated by using a ll0-i.tm-cailber nozzle. The feature size of deposited patterns is about half of the nozzle caliber, and a finer resolution can be achieved with the intro- duction of smaller nozzle calibers. Furthermore, the appropriate curing condition is investigated for sufficient combustion of ink solvent. The minimum resistivity of 3.3 gf~ cm is demonstrated for a continuous track cured at 200~C for 10 min. Eventu- ally, several passive electrical components, such as coated resistors, interdigitated capacitors (6 pF), and spiral inductors (0.6 gH), are successfully fabricated.

关 键 词:electrohydrodynamic printing inkjet printing drop on demand printed electronics silver ink conductive pattern 

分 类 号:TN78[电子电信—电路与系统] TF832[冶金工程—有色金属冶金]

 

参考文献:

正在载入数据...

 

二级参考文献:

正在载入数据...

 

耦合文献:

正在载入数据...

 

引证文献:

正在载入数据...

 

二级引证文献:

正在载入数据...

 

同被引文献:

正在载入数据...

 

相关期刊文献:

正在载入数据...

相关的主题
相关的作者对象
相关的机构对象