香豆素添加剂对低温碱性化学镀镍-磷的影响  

Influence of Coumarin Additive on Deposition Rate as well as Microstructure and Performance of Electroless Ni-P Alloy Coating in Alkaline Bath at Low Temperature

作　　者：黄草明[1] 

机构地区：[1]中国有色矿业集团有限公司科技部,北京100029

出　　处：《材料保护》2012年第5期12-14,23,共4页Materials Protection

摘　　要：为了进一步将低温碱性化学镀镍-磷应用于工业生产,在已开发的低温碱性化学镀镍工艺基础上,重点研究了香豆素添加剂对镀速和镀层的影响。结果表明:少量香豆素能使镀速增大,但浓度大于10 mg/L后镀速反会降低;香豆素为10 mg/L时镀层平滑、致密,由球形颗粒组成,大小均匀,约为5～6μm,晶粒间无孔隙;香豆素对镍-磷镀层的组成基本无影响;香豆素为10 mg/L时镀层的XRD谱由Ni主衍射峰及Ni5P4次衍射峰组成;香豆素对Ni沉积峰电位无显著影响,但会使其阴极峰电流密度增大,且随香豆素浓度的增加先增大后减小;香豆素与磺酸类添加剂的协同作用使阴极峰电位显著负移,过电位增大。Coumarin as a kind of additive was introduced into the alkaline bath for electroless nickel plating under low temperature.The effects of coumarin on the deposition rate as well as microstructure and performance of as-plated Ni-P alloy coating were investigated.It was found that the introduction of a small amount of coumarin contributed to increased deposition rate of Ni-P alloy coating,but the deposition rate was reduced when the dosage of coumarin was over 10 mg/L.Ni-P alloy coating obtained at a coumarin concentration of 10 mg/L,composed of spherical grains with even size of about 5~6 μm,was relatively dense and smooth,and had no inter-granular pores.In the meantime,coumarin had almost no influence on the composition of electroless Ni-P alloy coating,and it had insignificant effect on the peak deposition potential of Ni.However,introducing coumarin in the plating bath led to increase in the cathodic peak current(the cathodic peak current initially rose with increasing concentration of coumarin but later declined).In one word,there existed a synergistic effect between coumarin and sulfonic acid-type additives,which led to significant negative shift of cathodic peak potential and increase of overpotential.

关 键 词：化学镀镍-磷 碱性镀液 香豆素 低温 

分 类 号：TQ153.14[化学工程—电化学工业]