电流密度对熔融盐电沉积金属钨镀层性能的影响  

Effect of current density on properties of tungsten coating electrodeposited from molten salt

作　　者：刘艳红[1] 张迎春[1] 刘其宗[1] 李旭亮[1] 江凡[1] 葛昌纯[1] 

机构地区：[1]北京科技大学,北京100086

出　　处：《电镀与涂饰》2012年第5期1-5,共5页Electroplating & Finishing

基　　金：国际热核聚变实验堆(ITER)计划专项;聚变堆面向等离子体材料的基础研究(2010GB109000);国家自然科学基金(50972008)

摘　　要：采用二元熔盐氧化物Na2WO4和WO3,以脉冲电沉积的方法在占空比0.5、脉冲频率1000Hz、电沉积温度850°C的条件下,于热沉材料CuCrZr之上获得了金属钨镀层。讨论了电流密度对钨镀层微观结构、显微硬度、结合强度等性能的影响。当电流密度为20～30mA/cm2时,能够获得表面致密均匀的钨镀层。随着电流密度的增大,电流效率呈现先增大后下降的趋势,当电流密度为30mA/cm2时,电流效率达到最大值92.64%。Metallic tungsten coatings were obtained by pulsed electrodeposition on Cu-Cr-Zr alloy, a heat sink material, from binary molten salt NazWO4-WO3 at 850 ~C with duty cycle 0.5 and frequency 1 000 Hz. The effect of current density on microstructure, microhardness, and bonding strength were discussed. Uniform and compact tungsten coatings were obtained when the current density varied from 20 mA/cm2 to 30 mA/cm2. The current efficiency was increased initially and then decreased with the increasing of current density, and reached the maximum value （92.64%） at 30 mA/cm2.

关 键 词：铜-铬-锆合金 钨 熔盐 电沉积 电流密度 微观结构 电流效率 

分 类 号：TF111.522[冶金工程—冶金物理化学] TQ151.9[化学工程—电化学工业]